Home / Application / Electronics
Testing of gold plate welded by laser solder ball
With the development of microelectronics industry to lightweight, thin, miniaturization, the increase of the number of I / O terminals and the diversification of functions, flip chip packaging technology came into being, and underfill is the core process.The underfill process of
chip is to fill the gap between the chip and the substrate with glue to protect and strengthen the solder ball or solder pin. It is commonly used in flipchip packaging.
?
Contact information
Telephone：0769-23127991
Mail：[email protected]
Address： 1st floor, Building A, science and Technology Creative Industrial Park, new base, No. 5, Xinji Road, Nancheng District, Dongguan City, Guangdong Province
Follow us
Public account
Mobile station
Links
?2025 Dongguan Shiqiao Mechanical and Electrical Equipment Co., Ltd. all rights reserved Fluid control technology and equipment manufacturer Yue ICP Bei No. 15096235 Technical Support：Tuohai Network